CPU cooling structure

ABSTRACT

A CPU cooling structure includes a heat sink and an axial flow fan adapted to dissipate heat from the CPU of the motherboard in a computer, the heat sink having a hollow center shaft filled up with a heat transfer fluid and a plurality of radiation fins equiangularly radially arranged around the periphery of the center shaft and curved in direction corresponding or reversed to the direction of rotation of the fan blade and hub assembly of the axial flow fan.

BACKGROUND OF THE INVENTION

[0001] The present invention relates to a CPU cooling structure adaptedto lower the temperature of the CPU of a computer during its operationand, more particularly, to such a CPU cooling structure, which enablesinduced currents of air to pass toward the CPU and the surroundingelectronic component parts to quickly dissipate heat from the CPU andthe surrounding electronic component parts.

[0002] Advanced CPUs (central processing units) provide a highoperational speed, and simultaneously produce a high temperature duringits operation. In order to keep the CPU of the motherboard to functionnormally, a CPU cooling structure is needed. High performance and lowmanufacturing cost are important factors in designing a CPU coolingstructure. FIG. 13 shows a heat sink for use with a fan in a computer todissipate heat from the CPU. This structure of heat sink A comprises aflat base A1 and a plurality of upright radiation fins A11 arranged inparallel on the top side of the flat base A1. When used with an axialflow fan, the axial flow of air induced by the axial flow fan is stoppedby the flat base A1 of the heat sink A and forced sideways, i.e., theaxial flow of air does not pass to the CPU and the surroundingelectronic component parts. Due to this problem, the heat dissipationefficiency of the heat sink A is low.

SUMMARY OF THE INVENTION

[0003] The present invention has been accomplished to provide a CPUcooling structure, which eliminates the aforesaid drawbacks. Accordingto one aspect of the present invention, the CPU cooling structurecomprises a heat sink and an axial flow fan. The heat sink has a centershaft disposed in contact with the CPU to be cooled down and a pluralityof radiation fins equiangularly radially arranged around the peripheryof the center shaft. The radiation fins may be curved in directioncorresponding or reversed to the direction of rotation of the fan bladeand hub assembly of the axial flow fan. During operation, the inducedaxial flow of air passes through the gaps in between the radiation finsof the heat sink toward the CPU and the surrounding electronic componentparts to dissipate heat from the CPU and the surrounding electroniccomponent parts. According to another aspect of the present invention,the center shaft of the heat sink can be made having a hollow structurefilled with a heat transfer fluid for quick transfer of heat from theCPU to the radiation fins.

BRIEF DESCRIPTION OF THE DRAWINGS

[0004]FIG. 1 is an elevational view of a heat sink for a CPU coolingstructure according to a first embodiment of the present invention.

[0005]FIG. 2 is a side view in section of the heat sink shown in FIG. 1.

[0006]FIG. 3 is an exploded view of the CPU cooling structure accordingto the first embodiment of the present invention.

[0007]FIG. 4 is an installed view of FIG. 3.

[0008]FIG. 5 is a side view in section of FIG. 4.

[0009]FIG. 6 is a schematic drawing showing radiation fins of the heatsink curved in direction reversed to the direction of rotation of theaxial flow fan according to the first embodiment of the presentinvention.

[0010]FIG. 7 is an exploded view of the CPU cooling structure accordingto the second embodiment of the present invention.

[0011]FIG. 8 is an installed view of the second embodiment of thepresent invention.

[0012]FIG. 9 is a schematic drawing showing radiation fins of the heatsink curved in direction corresponding to the direction of rotation ofthe axial flow fan according to the second embodiment of the presentinvention.

[0013]FIG. 10 is an installed view of the CPU cooling structureaccording to the third embodiment of the present invention.

[0014]FIG. 11 is a side view in section of FIG. 10.

[0015]FIG. 12 is a schematic drawing showing radiation fins of the heatsink curved in direction reversed to the direction of rotation of theaxial flow fan according to the third embodiment of the presentinvention.

[0016]FIG. 13 is an elevational view of a heat sink according to theprior art.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT

[0017] Referring to FIGS. 1 and 2, a heat sink 1 is shown comprising ahollow center shaft 11, an enclosed fluid chamber 111 defined in thecenter shaft 11, a heat transfer fluid 113 filled in the enclosed fluidchamber 111, and a plurality of radiation fins 12 radially arrangedaround the periphery of the center shaft 11. The center shaft 11 has aflat bottom contact surface 112.

[0018] Referring to FIGS. 3 and 4 and FIG. 2 again, the heat sink 1 isused with an axial flow fan 2 to cool the temperature of the CPU 31 in amotherboard 3. Tie screws 4 are mounted in respective mounting holes 21of axial flow fan 2 and threaded into gaps 121 in between the radiationfins 12 to secure the axial flow fan 2 to the top side of the heat sink1. The flat bottom contact surface 112 of the hollow center shaft 11 ofthe heat sink 1 is disposed in contact with the top surface of the CPU31. Further, the radiation fin 12 of the heat sink 1 are smoothly archedand radially curved in direction reverse to the direction of rotation ofthe fan blade and hub assembly 22 of the axial flow fan 2.

[0019] Referring to FIGS. 5 and 6 and FIG. 4 again, during operation ofthe CPU 31, heat is transferred from the CPU 31 to the heat transferfluid 113 through the flat bottom contact surface 112 of the hollowcenter shaft 11 of the heat sink 1, and then quickly transferred fromthe heat transfer fluid 113 to the radiation fins 12, the axial flow ofair induced by the axial flow fan 2 continuously passes through the gaps121 in between the radiation fins 12 toward the top surface of the CPU31 and the surrounding electronic component parts 32 to quicklydissipate heat from the heat sink 1, the CPU 31, and the surroundingelectronic component parts 32.

[0020] FIGS. from 7 through 9 show an alternate form of the presentinvention. According to this alternate form, the radiation fins 12 aresmoothly arched and radially curved in direction corresponding to thedirection of rotation of the fan blade and hub assembly 22 of the axialflow fan 2. During operation, heat is transferred in proper order fromthe CPU 31 to the flat bottom contact surface 112 of the hollow centershaft 11, the heat transfer fluid 113, and the radiation fins 12, and atthe same time the axial flow of air induced by the axial flow fan 2continuously passes through the gaps 121 in between the radiation fins12 toward the top surface of the CPU 31 and the surrounding electroniccomponent parts 32 to quickly dissipate heat from the heat sink 1, theCPU 31, and the surrounding electronic component parts 32.

[0021] FIGS. from 10 through 12 show another alternate form of thepresent invention. According to this embodiment, the center shaft 11 ofthe heat sink 1 is a solid shaft, and the radiation fins 12 are smoothlyarched and radially curved in direction reversed to the direction ofrotation of the fan blade and hub assembly 22 of the axial flow fan 2.During operation, heat is transferred from the CPU 31 to the solidcenter shaft 11 and then the radiation fins 12, and at the same time theaxial flow of air induced by the axial flow fan 2 continuously passesthrough the gaps 121 in between the radiation fins 12 toward the topsurface of the CPU 31 and the surrounding electronic component parts 32to quickly dissipate heat from the heat sink 1, the CPU 31, and thesurrounding electronic component parts 32.

[0022] A prototype of heat sink has been constructed with the featuresof the annexed drawings of FIGS. 1˜12. The heat sink functions smoothlyto provide all of the features discussed earlier.

[0023] Although particular embodiments of the invention have beendescribed in detail for purposes of illustration, various modificationsand enhancements may be made without departing from the spirit and scopeof the invention. Accordingly, the invention is not to be limited exceptas by the appended claims.

What the invention claimed is:
 1. A CPU cooling structure comprising aheat sink disposed in contact with the surface of the CPU (centralprocessing unit) of the motherboard in a computer, and an axial flow fanfastened to a top side of said heat sink and having a fan blade and hubassembly rotated to cause an axial flow of air toward said heat sink andsaid CPU and to dissipate heat from said heat sink and said CPU, whereinsaid heat sink comprises a center shaft and a plurality of radiationfins equiangularly radially arranged around the periphery of said centershaft and curved in direction reversed to the direction of rotation ofthe fan blade and hub assembly of said axial flow fan.
 2. The CPUcooling structure as claimed in claim 1 wherein said center shaftcomprises an enclosed fluid chamber and a heat transfer fluid filled insaid enclosed fluid chamber.
 3. A CPU cooling structure comprising aheat sink disposed in contact with the surface of the CPU (centralprocessing unit) of the motherboard in a computer, and an axial flow fanfastened to a top side of said heat sink and having a fan blade and hubassembly rotated to cause an axial flow of air toward said heat sink andsaid CPU and to dissipate heat from said heat sink and said CPU, whereinsaid heat sink comprises a center shaft and a plurality of radiationfins equiangularly radially arranged around the periphery of said centershaft and curved in direction corresponding to the direction of rotationof the fan blade and hub assembly of said axial flow fan, said centershaft comprising an enclosed fluid chamber and a heat transfer fluidfilled in said enclosed fluid chamber.